OE Wire Bonder 360

The OE Wire Bonder 360 (commonly referred to as the OE360) is a gold-wire ball bonder designed primarily for the packaging of LEDs and low-to-medium-power semiconductor devices. It is suitable for internal wire bonding on various platforms, including SMD lead frames (such as 3528 and 5050 types), high-power LEDs, DIP components, and other standard LED lead frames. The equipment features a high degree of automation; it utilizes a CCD camera to capture images, with a computer controlling precise motion. It is easy to operate—even beginners can learn to use it in a short amount of time—and a single operator can manage multiple units simultaneously.